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CIME2024 Thermal Conductive and Heat Dissipation Materials Expo

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CIME2024 Thermal Conductive and Heat Dissipation Materials Expo
Latest company news about CIME2024 Thermal Conductive and Heat Dissipation Materials Expo

 

THE 12TH SHENZHEN HEAT CONDUCTION HEAT DISSIPATION MATERIALS EXPO 2024

 

CIME2024

 

IQUALITROL will participate CIME2024 the 12th Shenzhen International Thermal Conductive and Heat Dissipation Materials and Equipment Exhibition will be held at the Shenzhen International Convention and Exhibition Center from June 26 to 28, 2024, with an exhibition area of 30,000 square meters, 600 exhibitors, 30 academic reports, and 40,000 professional visitors.

 

We will display latest developed hardness testers, metallographic grinding and polishing machine, metallurgical microscopes and video measuring machine.

 

latest company news about CIME2024 Thermal Conductive and Heat Dissipation Materials Expo  0

 

 

CIME2024 is the world's first exhibition in the thermal management industry. The exhibition has been held since 2013 and has been successfully held for 11 sessions. Since 2023, the exhibition will be held in Shenzhen in June and Shanghai in December every year.

 

This exhibition is based in Shenzhen and radiates to the whole country and even the world. Trade, help enterprises open up the overall market.

 

The exhibition brings together various types of brand companies in the categories of thermal conductive fillers, thermal interface materials, carbon materials, graphene, ceramic substrates, high-performance heat dissipation materials, liquid cooling and heat dissipation technology, production and processing equipment, etc., providing a professional and efficient one-stop service platform for purchasing and selecting products and business exchanges for people in the entire thermal control industry.

 

At that time, we warmly welcome domestic and foreign thermal conductive and heat dissipation material companies and related industry professionals to visit and communicate!

 

According to statistics, material failure caused by heat concentration in electronic devices accounts for 65% to 80% of the total failure rate.

 

In order to avoid device failure caused by overheating, technologies such as thermal grease, thermal conductive gel, graphite thermal conductive sheet, heat pipe and heat spreader (VC) have appeared and continued to evolve. Thermal conductive and heat dissipation materials have become a "hard demand" for electronic devices in the 5G era.

 

latest company news about CIME2024 Thermal Conductive and Heat Dissipation Materials Expo  1

 

Pub Time : 2024-06-23 07:20:02 >> News list
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